담당업무

ㆍWork with Central Engineering teams in Korea, Phoenix, and East Fishkill to development and implement new technology into manufacturing.

ㆍEnhance technical skills in embedding and packaging, wafer thinning, plated and sputtered metallization.

ㆍUnderstand development strategy and able to convert to (and drive) actionable goals.

ㆍAssist in driving accountability throughout team to meet metrics.

ㆍDeliver processes and metrics towards meeting project goals and timelines.

ㆍSupport and work with the Package Development Teams with process integration, data analytics and reports.

ㆍInnovation in support of new IP and roadmap

자격요건

ㆍBS degree in Engineering or technical field. MS degree is a plus. 

ㆍ5+ years’ experience in semiconductor processing.  Knowledge of wafer thinning, sputter, plating, photolithography, and wafer bonding is preferred.

ㆍExperience working in cross-functional teams to achieve goals and metrics.

ㆍ“Hands-on” experience with tools and processes

ㆍExperience with FMEA risk analysis

ㆍIntermediate level data analysis skills specifically in Excel or JMP using formulas, pivots, and charts are required.

ㆍProficiency in Microsoft office, particularly PowerPoint

ㆍStrong communication skills with experience presenting technical project details.

ㆍSelf-motivated and results oriented.

ㆍFluency (written and oral) in English and Korean required.