Role and Responsibilities:

- Experience of package reliability test (Environment, Lifetime test).

- In-depth knowledge about various reliability equipment/tools, test conditions and principles. (MSL, HTSL, TMCL, HAST, RFHTOL, ESD)

- Failure analysis experience on various assembly package and wafer level defects.

- Ability of effective problem solving and quality improvement through statistical analysis.

- Understanding SIP module assembly process, wafer fab and the electrical test.

- The ability to co-work with IC designers and other teams to identify the cause of failures.

- Generate detailed reliability reports for both internal and external customers.

자격요건

ㆍ학력 : 학사이상

ㆍ경력 : 5년이상

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