담당업무

ㆍNew Module product design and proposal for new module opportunity

   - Gel-filled and Transfer Molded type product

ㆍProduct concept design for Gel-filled and Transfer Molded module

ㆍElectrical simulation to verify Product concept design.

   - Performance verification and to mitigate/minimize potential risk

ㆍAnalyzing performance gap between concept product simulation and actual product

ㆍSurvey Industrial application system trend and topologies

ㆍBenchmark and Survey

   - Competitor product portfolio and its targeted applications

   - Die & Product level performance

자격요건

ㆍBS or MS in Electrical/Electronic engineering, MS is preferred

ㆍMore than 5-year experience against Power Electronics engineering

ㆍKnowledge of Power Devices such as IGBT, MOSFET, Diode and SiC (MOSFET, Diode)

ㆍKnowledge of Package material`s property, PKG structure and it`s assembly process

  - Modules (Gel filled & Transfer Molded packages) and Discrete product

ㆍExcellent technical diagnostic, Problem solving skills

ㆍElectrical simulation skills such as SIMetrix, Pspice, LT Spice and Plexim

  - Die level, Module & System level

ㆍ2D & 3D Design skills with CAD software

  - AutoCAD (2D : mandatory)

  - Solidworks (3D : nice to have)

ㆍProactive, hands-on attitude, skilled technical approach

ㆍExcellent presentation and logical communication skills in English